JPH0453267B2 - - Google Patents

Info

Publication number
JPH0453267B2
JPH0453267B2 JP59218495A JP21849584A JPH0453267B2 JP H0453267 B2 JPH0453267 B2 JP H0453267B2 JP 59218495 A JP59218495 A JP 59218495A JP 21849584 A JP21849584 A JP 21849584A JP H0453267 B2 JPH0453267 B2 JP H0453267B2
Authority
JP
Japan
Prior art keywords
etching
conductivity type
cantilever
semiconductor
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59218495A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6197572A (ja
Inventor
Koichi Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP59218495A priority Critical patent/JPS6197572A/ja
Priority to US06/780,933 priority patent/US4706374A/en
Priority to DE8585113191T priority patent/DE3585587D1/de
Priority to EP85113191A priority patent/EP0178662B1/en
Publication of JPS6197572A publication Critical patent/JPS6197572A/ja
Publication of JPH0453267B2 publication Critical patent/JPH0453267B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C11/00—Pivots; Pivotal connections
    • F16C11/04—Pivotal connections
    • F16C11/12—Pivotal connections incorporating flexible connections, e.g. leaf springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Sensors (AREA)
  • Weting (AREA)
JP59218495A 1984-10-19 1984-10-19 半導体加速度センサの製造方法 Granted JPS6197572A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP59218495A JPS6197572A (ja) 1984-10-19 1984-10-19 半導体加速度センサの製造方法
US06/780,933 US4706374A (en) 1984-10-19 1985-09-27 Method of manufacture for semiconductor accelerometer
DE8585113191T DE3585587D1 (de) 1984-10-19 1985-10-17 Verfahren zur herstellung eines halbleiterbeschleunigungsmessers.
EP85113191A EP0178662B1 (en) 1984-10-19 1985-10-17 Method of manufacture for semiconductor accelerometer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59218495A JPS6197572A (ja) 1984-10-19 1984-10-19 半導体加速度センサの製造方法

Publications (2)

Publication Number Publication Date
JPS6197572A JPS6197572A (ja) 1986-05-16
JPH0453267B2 true JPH0453267B2 (en]) 1992-08-26

Family

ID=16720823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59218495A Granted JPS6197572A (ja) 1984-10-19 1984-10-19 半導体加速度センサの製造方法

Country Status (4)

Country Link
US (1) US4706374A (en])
EP (1) EP0178662B1 (en])
JP (1) JPS6197572A (en])
DE (1) DE3585587D1 (en])

Families Citing this family (85)

* Cited by examiner, † Cited by third party
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JPS638565A (ja) * 1986-06-27 1988-01-14 Mitsubishi Electric Corp 半導体加速度検出装置
EP0275338B1 (de) * 1987-01-20 1990-08-16 LITEF GmbH Biegefedergelenk und Verfahren zu seiner Herstellung
US4948757A (en) * 1987-04-13 1990-08-14 General Motors Corporation Method for fabricating three-dimensional microstructures and a high-sensitivity integrated vibration sensor using such microstructures
US4851080A (en) * 1987-06-29 1989-07-25 Massachusetts Institute Of Technology Resonant accelerometer
EP0309782B1 (de) * 1987-09-30 1994-06-01 Siemens Aktiengesellschaft Verfahren zum Ätzen von (100) Silizium
FI81915C (fi) * 1987-11-09 1990-12-10 Vaisala Oy Kapacitiv accelerationsgivare och foerfarande foer framstaellning daerav.
US5121633A (en) * 1987-12-18 1992-06-16 Nissan Motor Co., Ltd. Semiconductor accelerometer
US5216490A (en) * 1988-01-13 1993-06-01 Charles Stark Draper Laboratory, Inc. Bridge electrodes for microelectromechanical devices
JP2741861B2 (ja) * 1988-02-26 1998-04-22 株式会社日立製作所 振動子
US4918032A (en) * 1988-04-13 1990-04-17 General Motors Corporation Method for fabricating three-dimensional microstructures and a high-sensitivity integrated vibration sensor using such microstructures
JPH07113647B2 (ja) * 1988-09-02 1995-12-06 日産自動車株式会社 半導体加速度センサ
EP0363005B1 (en) * 1988-09-02 1996-06-05 Honda Giken Kogyo Kabushiki Kaisha A semiconductor sensor
US4922277A (en) * 1988-11-28 1990-05-01 The United States Of America As Represented By The Secretary Of The Air Force Silicon wafer photoresist developer
US5072288A (en) * 1989-02-21 1991-12-10 Cornell Research Foundation, Inc. Microdynamic release structure
US5149673A (en) * 1989-02-21 1992-09-22 Cornell Research Foundation, Inc. Selective chemical vapor deposition of tungsten for microdynamic structures
JPH03156978A (ja) * 1989-11-15 1991-07-04 Toshiba Corp 半導体センサー
US5283459A (en) * 1989-11-15 1994-02-01 Kabushiki Kaisha Toshiba Semiconductor sensor including an aperture having a funnel shaped section intersecting a second section
US5126812A (en) * 1990-02-14 1992-06-30 The Charles Stark Draper Laboratory, Inc. Monolithic micromechanical accelerometer
US5473945A (en) * 1990-02-14 1995-12-12 The Charles Stark Draper Laboratory, Inc. Micromechanical angular accelerometer with auxiliary linear accelerometer
US5068203A (en) * 1990-09-04 1991-11-26 Delco Electronics Corporation Method for forming thin silicon membrane or beam
US5063177A (en) * 1990-10-04 1991-11-05 Comsat Method of packaging microwave semiconductor components and integrated circuits
US5408119A (en) * 1990-10-17 1995-04-18 The Charles Stark Draper Laboratory, Inc. Monolithic micromechanical vibrating string accelerometer with trimmable resonant frequency
US5605598A (en) * 1990-10-17 1997-02-25 The Charles Stark Draper Laboratory Inc. Monolithic micromechanical vibrating beam accelerometer with trimmable resonant frequency
US5103279A (en) * 1990-10-18 1992-04-07 Motorola, Inc. Field effect transistor with acceleration dependent gain
JPH05196458A (ja) * 1991-01-04 1993-08-06 Univ Leland Stanford Jr 原子力顕微鏡用ピエゾ抵抗性片持ばり構造体
JPH04258175A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp シリコン半導体加速度センサの製造方法
US5129983A (en) * 1991-02-25 1992-07-14 The Charles Stark Draper Laboratory, Inc. Method of fabrication of large area micromechanical devices
US5203208A (en) * 1991-04-29 1993-04-20 The Charles Stark Draper Laboratory Symmetrical micromechanical gyroscope
JP2587147B2 (ja) * 1991-05-17 1997-03-05 本田技研工業株式会社 半導体センサ
US5331852A (en) * 1991-09-11 1994-07-26 The Charles Stark Draper Laboratory, Inc. Electromagnetic rebalanced micromechanical transducer
US5635639A (en) * 1991-09-11 1997-06-03 The Charles Stark Draper Laboratory, Inc. Micromechanical tuning fork angular rate sensor
JP3261544B2 (ja) * 1991-10-03 2002-03-04 キヤノン株式会社 カンチレバー駆動機構の製造方法、プローブ駆動機構の製造方法、カンチレバー駆動機構、プローブ駆動機構、及びこれを用いたマルチプローブ駆動機構、走査型トンネル顕微鏡、情報処理装置
US5408877A (en) * 1992-03-16 1995-04-25 The Charles Stark Draper Laboratory, Inc. Micromechanical gyroscopic transducer with improved drive and sense capabilities
US5767405A (en) * 1992-04-07 1998-06-16 The Charles Stark Draper Laboratory, Inc. Comb-drive micromechanical tuning fork gyroscope with piezoelectric readout
US5349855A (en) * 1992-04-07 1994-09-27 The Charles Stark Draper Laboratory, Inc. Comb drive micromechanical tuning fork gyro
US5357803A (en) * 1992-04-08 1994-10-25 Rochester Institute Of Technology Micromachined microaccelerometer for measuring acceleration along three axes
US5277064A (en) * 1992-04-08 1994-01-11 General Motors Corporation Thick film accelerometer
DE69334194T2 (de) * 1992-04-22 2008-12-04 Denso Corp., Kariya-shi Verfahren zum Erzeugen einer Halbleitervorrichtung
JP2776142B2 (ja) * 1992-05-15 1998-07-16 株式会社日立製作所 加速度センサ
US5397904A (en) * 1992-07-02 1995-03-14 Cornell Research Foundation, Inc. Transistor microstructure
US5549785A (en) * 1992-09-14 1996-08-27 Nippondenso Co., Ltd. Method of producing a semiconductor dynamic sensor
FR2700065B1 (fr) * 1992-12-28 1995-02-10 Commissariat Energie Atomique Procédé de fabrication d'accéléromètres utilisant la technologie silicium sur isolant.
US5399415A (en) * 1993-02-05 1995-03-21 Cornell Research Foundation, Inc. Isolated tungsten microelectromechanical structures
US5650568A (en) * 1993-02-10 1997-07-22 The Charles Stark Draper Laboratory, Inc. Gimballed vibrating wheel gyroscope having strain relief features
DE4309206C1 (de) * 1993-03-22 1994-09-15 Texas Instruments Deutschland Halbleitervorrichtung mit einem Kraft- und/oder Beschleunigungssensor
US5563343A (en) * 1993-05-26 1996-10-08 Cornell Research Foundation, Inc. Microelectromechanical lateral accelerometer
US5426070A (en) * 1993-05-26 1995-06-20 Cornell Research Foundation, Inc. Microstructures and high temperature isolation process for fabrication thereof
US5610335A (en) * 1993-05-26 1997-03-11 Cornell Research Foundation Microelectromechanical lateral accelerometer
US5536988A (en) * 1993-06-01 1996-07-16 Cornell Research Foundation, Inc. Compound stage MEM actuator suspended for multidimensional motion
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US5508231A (en) * 1994-03-07 1996-04-16 National Semiconductor Corporation Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
US5484073A (en) * 1994-03-28 1996-01-16 I/O Sensors, Inc. Method for fabricating suspension members for micromachined sensors
US5629244A (en) * 1994-04-28 1997-05-13 Nec Corporation Fabrication method of semiconductor accelerometer
US5646348A (en) * 1994-08-29 1997-07-08 The Charles Stark Draper Laboratory, Inc. Micromechanical sensor with a guard band electrode and fabrication technique therefor
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JPH0936385A (ja) * 1995-07-25 1997-02-07 Nissan Motor Co Ltd 半導体装置の製造方法
JP3433871B2 (ja) * 1996-01-26 2003-08-04 株式会社デンソー 集積化半導体歪みセンサ及びその製造方法
US5817942A (en) * 1996-02-28 1998-10-06 The Charles Stark Draper Laboratory, Inc. Capacitive in-plane accelerometer
US5892153A (en) * 1996-11-21 1999-04-06 The Charles Stark Draper Laboratory, Inc. Guard bands which control out-of-plane sensitivities in tuning fork gyroscopes and other sensors
US5783973A (en) * 1997-02-24 1998-07-21 The Charles Stark Draper Laboratory, Inc. Temperature insensitive silicon oscillator and precision voltage reference formed therefrom
US5911156A (en) * 1997-02-24 1999-06-08 The Charles Stark Draper Laboratory, Inc. Split electrode to minimize charge transients, motor amplitude mismatch errors, and sensitivity to vertical translation in tuning fork gyros and other devices
US5952574A (en) * 1997-04-29 1999-09-14 The Charles Stark Draper Laboratory, Inc. Trenches to reduce charging effects and to control out-of-plane sensitivities in tuning fork gyroscopes and other sensors
US5914553A (en) * 1997-06-16 1999-06-22 Cornell Research Foundation, Inc. Multistable tunable micromechanical resonators
US6756247B1 (en) 1998-01-15 2004-06-29 Timothy J. Davis Integrated large area microstructures and micromechanical devices
JP2000088878A (ja) * 1998-09-09 2000-03-31 Tokai Rika Co Ltd 加速度スイッチ及びその製造方法
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US6628041B2 (en) 2000-05-16 2003-09-30 Calient Networks, Inc. Micro-electro-mechanical-system (MEMS) mirror device having large angle out of plane motion using shaped combed finger actuators and method for fabricating the same
US6585383B2 (en) 2000-05-18 2003-07-01 Calient Networks, Inc. Micromachined apparatus for improved reflection of light
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JP4306162B2 (ja) * 2001-08-22 2009-07-29 株式会社デンソー 半導体装置およびその製造方法
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JP5824876B2 (ja) * 2011-05-30 2015-12-02 セイコーエプソン株式会社 物理量検出器の製造方法
US9222956B2 (en) * 2013-11-26 2015-12-29 Raytheon Company High bandwidth linear flexure bearing
CN106460983B (zh) * 2014-05-06 2018-11-13 麦斯卓有限公司 挠曲件、包括挠曲件阵列的平台及挠曲件的制作方法
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US11258158B2 (en) 2017-08-17 2022-02-22 Raytheon Company Apparatus and method for providing linear motion of a device
US10670825B2 (en) 2018-08-23 2020-06-02 Raytheon Company Mounting devices with integrated alignment adjustment features and locking mechanisms
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4553436A (en) * 1982-11-09 1985-11-19 Texas Instruments Incorporated Silicon accelerometer
JPS6055655A (ja) * 1983-09-07 1985-03-30 Nissan Motor Co Ltd 梁構造体を有する半導体装置
US4549427A (en) * 1983-09-19 1985-10-29 The United States Of America As Represented By The Secretary Of The Air Force Electronic nerve agent detector
US4597003A (en) * 1983-12-01 1986-06-24 Harry E. Aine Chemical etching of a semiconductive wafer by undercutting an etch stopped layer

Also Published As

Publication number Publication date
US4706374A (en) 1987-11-17
DE3585587D1 (de) 1992-04-16
EP0178662A2 (en) 1986-04-23
EP0178662B1 (en) 1992-03-11
JPS6197572A (ja) 1986-05-16
EP0178662A3 (en) 1988-08-24

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